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| M Features * * * * * * * Temperature-to-Digital Converter SPITM Compatible Interface 10-Bit Resolution (0.25C/Bit) 2C (max.) Accuracy from -40C to +85C 3C (max.) Accuracy from -55C to +125C 2.65V to 5.5V Operating Range Low Power Consumption: - 250 A (typ.) Continuous Temperature Conversion Mode - 1 A (max.) Shutdown Mode * Power Saving One-Shot Temperature Measurement * Industry Standard 8-Pin MSOP Package * Space Saving 8-Pin DFN (3x3 mm) Package TC72 General Description The TC72 is a digital temperature sensor capable of reading temperatures from -55C to +125C. This sensor features a serial interface that allows communication with a host controller or other peripherals. The TC72 interface is compatible with the SPI protocol. The TC72 does not require any additional external components. However, it is recommended that a decoupling capacitor of 0.01 F to 0.1 F be provided between the VDD and GND pins. The TC72 can be used either in a Continuous Temperature Conversion mode or a One-Shot Conversion mode. The Continuous Conversion mode measures the temperature approximately every 150 ms and stores the data in the temperature registers. In contrast, the One-Shot mode performs a single temperature measurement and returns to the power saving shutdown mode. The TC72 features high temperature accuracy, easeof-use and is the ideal solution for implementing thermal management in a variety of systems. The device is available in both 8-pin MSOP and 8-pin DFN spacesaving packages. The TC72 also features a shutdown mode for low power operation. Digital Temperature Sensor with SPITM Interface Typical Applications * * * * * * * Personal Computers and Servers Hard Disk Drives and Other PC Peripherals Entertainment Systems Office Equipment Datacom Equipment Mobile Phones General Purpose Temperature Monitoring Block Diagram VDD Internal Diode Temperature Sensor TC72 Package Types MSOP NC 1 CE 2 SCK 3 GND 4 8 VDD 7 NC 6 SDI 5 SDO TC72 DFN NC 1 SCK 2 CE 3 GND 4 8 VDD 7 NC 6 SDO 5 SDI 10-Bit Sigma Delta A/D Converter Manufacturer ID Register CE SCK SDO SDI Temperature Register GND Serial Port Interface 2002 Microchip Technology Inc. TC72 Control Register DS21743A-page 1 TC72 Typical Application VDD 0.1F VDD TC72 CE SCK SDO SDI GND PICmicro(R) MCU AN0 SCK SDI SDO DS21743A-page 2 2002 Microchip Technology Inc. TC72 1.0 1.1 ELECTRICAL CHARACTERISTICS Maximum Ratings PIN FUNCTION TABLE Name NC CE SCK GND SDO SDI NC VDD Function No Internal Connection Chip Enable Input, the device is selected when this input is high Serial Clock Input Ground Serial Data Output Serial Data Input No Internal Connection Power Supply VDD........................................................................ 6.0V All inputs and outputs w.r.t. GND ...-0.3V to VDD +0.3V Storage temperature .......................... -65C to +150C Ambient temp. with power applied ..... -55C to +125C Junction Temperature ........................................ 150C ESD protection on all pins: Human Body Model (HBM)............................. > 4 kV Man Machine Model (MM)............................. > 400V Latch-Up Current at each pin ........................ 200 mA Maximum Power Dissipation........................... 250 mW Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply at V DD = 2.65V to 5.5V, TA = -55C to +125 C. Parameters Power Supply Operating Voltage Range Operating Current: Normal Mode, ADC Active Shut-Down Supply Current Temperature Accuracy (Note 1) Resolution ADC Conversion Time Digital Input / Output High Level Input Voltage Low Level Input Voltage High Level Output Voltage Low Level Output Voltage Input Resistance Pin Capacitance VIH V IL VOH VOL RIN CIN COUT 0.7 VDD -- 0.7 VDD -- 1.0 -- -- -- -- -- -- -- 15 50 -- 0.2 VDD -- 0.2 VDD -- -- -- V V V V M pF IOH = 1 mA IOL = 4 mA tCONV V DD IDD-CON ISHD TACY 2.65 -- -- -2.0 -3.0 -- -- -- 250 0.1 -- -- 10 150 5.5 400 1.0 +2.0 +3.0 -- 200 Bits ms V A A C Note 1 Continuous temp. conversion mode (Shutdown Bit = `0') Shutdown Mode (Shutdown Bit = `1') -40C < TA < +85C -55C < TA < +125C Note 4 Sym Min Typ Max Units Conditions Temperature Sensor and Analog-to-Digital Converter Note 1: The TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX will operate from a supply voltage of 2.65V to 5.5V. However, the TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX are tested and specified at the nominal operating voltages of 2.8V, 3.3V and 5.0V respectively. As VDD varies from the nominal operating value, the accuracy may be degraded. Refer to Figure 2-5 and Figure 2-6. 2: Measured with a load of CL = 50 pF on the SDO output pin of the TC72. 3: All time measurements are measured with respect to the 50% point of the signal, except for the SCK rise and fall times. The rise and fall times are defined as the 10% to 90% transition time. 4: Resolution = Temperature Range/No. of Bits = (+127C - -128C) / (210) = 256/1024 = 0.25C/Bit 2002 Microchip Technology Inc. DS21743A-page 3 TC72 DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise noted, all parameters apply at V DD = 2.65V to 5.5V, TA = -55C to +125 C. Parameters Serial Port AC Timing (Note 2, 3) Clock Frequency SCK Low Time SCK High Time CE to SCK Setup SCK to Data Out Valid CE to Output Tri-state SCK to Data Hold Time Data to SCK Set-up Time SCK to CE Hold Time SCK Rise Time SCK Fall Time CE Inactive Time Thermal Package Resistance Thermal Resistance, MSOP-8 Thermal Resistance, DFN-8 JA JA -- -- 206 60.5 -- -- C/W C/W fCLK tCL tCH tCC tCDD tCDZ tCDH tDC tCCH tR tF tCWH DC 65 65 400 -- -- 35 35 100 -- -- 400 -- -- -- -- -- -- -- -- -- -- -- -- 7.5 -- -- -- 55 40 -- -- -- 200 200 -- MHz ns ns ns ns ns ns ns ns ns ns ns Sym Min Typ Max Units Conditions Note 1: The TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX will operate from a supply voltage of 2.65V to 5.5V. However, the TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX are tested and specified at the nominal operating voltages of 2.8V, 3.3V and 5.0V respectively. As VDD varies from the nominal operating value, the accuracy may be degraded. Refer to Figure 2-5 and Figure 2-6. 2: Measured with a load of CL = 50 pF on the SDO output pin of the TC72. 3: All time measurements are measured with respect to the 50% point of the signal, except for the SCK rise and fall times. The rise and fall times are defined as the 10% to 90% transition time. 4: Resolution = Temperature Range/No. of Bits = (+127C - -128C) / (210) = 256/1024 = 0.25C/Bit DS21743A-page 4 2002 Microchip Technology Inc. TC72 SPI READ DATA TRANSFER (CP = 0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7 = 0) tCWH CE 1/fCLK tCCH tCC SCK tDC SDI A7 tCDH MSb tF tR tCH tCL A0 LSb tCDD tCDZ D7 MSb D0 LSb HIGH Z SDO HIGH Z SPI WRITE DATA TRANSFER (CP = 0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7 = 1) tCWH CE 1/fCLK tCCH tF tR tDC SDI A7 = 1 MSb A0 LSb D7 tCDH MSb D0 LSb tCH tCL tCC SCK Note: The timing diagram is drawn with CP = 0. The TC72 also functions with CP = 1; however, the edges of SCK are reversed as defined in Table 3-3 and Figure 3-2. FIGURE 1-1: Serial Port Timing Diagrams. 2002 Microchip Technology Inc. DS21743A-page 5 TC72 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, all parameters apply at VDD = 2.65V to 5.5V, TA = -55C to +125C. 3.5 3 2.5 2 1.5 1 0.5 0 -0.5 -1 -1.5 -2 -2.5 -3 -3.5 Temperature Error (C) Shutdown Current (A) Upper Specification Limit 0.20 0.15 0.10 0.05 0.00 TC72-3.3MXX TC72-5.0MXX VDD = 3.3V VDD = 5.0V TC72-5.0MXX VDD = 2.8V Mean Mean + 3 Mean - 3 Lower Specification Limit -55 -25 5 35 65 95 125 -55 -25 5 35 65 95 125 Reference Temperature (C) Temperature (C) FIGURE 2-1: (TC72-X.XMXX). Accuracy vs. Temperature FIGURE 2-4: Temperature. 0.4 Shutdown Current vs. TC72-X.XMXX TA = +25C Temperature Change (C) 260 Supply Current (A) 250 240 230 220 210 200 0.3 0.2 0.1 0.0 -0.1 -0.2 -0.3 -0.4 TC72-2.8MXX TA = +85C TA = -55C TA = +125C 2.5 3.0 3.5 4.0 4.5 5.0 5.5 TA = +25C TA = -25C 2.6 2.7 2.8 Supply Voltage (V) 2.9 3.0 Supply Voltage (V) FIGURE 2-2: Voltage. Supply Current vs. Supply FIGURE 2-5: Temperature Accuracy vs. Supply Voltage (TC72-2.8MXX). 1.0 0.8 0.6 0.4 0.2 0.0 -0.2 -0.4 -0.6 -0.8 -1.0 Supply Current (uA) 350 300 250 200 150 100 50 0 -55 TC72-5.0MXX VDD = 5.0V TC72-3.3MXX VDD = 3.3V Temperature Change (C) 400 TC72-5.0MXX TA = +85C T A = -25C TA = +25C 4.5 4.6 4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5 Supply Voltage (V) TC72-2.8MXX VDD = 2.8V -25 5 35 65 95 125 Temperature (C) FIGURE 2-3: Temperature. Supply Current vs. FIGURE 2-6: Temperature Accuracy vs. Supply Voltage (TC72-5.0MXX). DS21743A-page 6 2002 Microchip Technology Inc. TC72 Note: Unless otherwise indicated, all parameters apply at VDD = 2.65V to 5.5V, TA = -55C to +125C. Percentage of Occurances (%) 50 45 40 35 30 25 20 15 10 5 0 0.5 -3 -2 -1 0 -2.5 -1.5 -0.5 TC72-X.XMXX Sample Size = 166 TA = -55C Percentage of Occurances (%) 60 50 40 30 20 10 0 0.00 0.25 0.50 0.75 1.00 1.25 2.5 -1.50 -1.25 -1.00 -0.75 -0.50 -0.25 1.50 2 3 TC72-X.XMXX Sample Size = 166 TA = +65C 1.5 2.5 1 2 Temperature Error (C) 3 Temperature Error (C) FIGURE 2-7: Histogram of Temperature Accuracy at -55 Degrees C. Percentage of Occurances (%) 60 50 40 30 20 10 0 -2 -1.5 -1 -0.5 0 0.5 1 1.5 2 Temperature Error (C) FIGURE 2-10: Histogram of Temperature Accuracy at +65 Degrees C. 50 45 40 35 30 25 20 15 10 5 0 -2 -1.5 -1 -0.5 0 Percentage of Occurances (%) TC72-X.XMXX Sample Size = 166 TA = -40C TC72-X.XMXX Sample Size = 166 TA = +85C 0.5 1 1.5 Temperature Error (C) FIGURE 2-8: Histogram of Temperature Accuracy at -40 Degrees C. Percentage of Occurances (%) 60 50 40 30 20 10 0 0.00 0.25 0.50 0.75 1.00 1.25 -1.50 -1.25 -1.00 -0.75 -0.50 -0.25 1.50 FIGURE 2-11: Histogram of Temperature Accuracy at +85 Degrees C. 40 35 30 25 20 15 10 5 0 0.5 -2.5 -1.5 -0.5 1.5 -3 -2 -1 0 1 2 TC72-X.XMXX Sample Size = 166 TA = +25C Percentage of Occurances (%) TC72-X.XMXX Sample Size = 166 TA = +125C Temperature Error (C) Temperature Error (C) FIGURE 2-9: Histogram of Temperature Accuracy at +25 Degrees C. FIGURE 2-12: Histogram of Temperature Accuracy at +125 Degrees C. 2002 Microchip Technology Inc. DS21743A-page 7 TC72 3.0 FUNCTIONAL DESCRIPTION The TC72 consists of a band-gap type temperature sensor, a 10-bit Sigma Delta Analog-to-Digital Converter (ADC), an internal conversion oscillator and a double buffer digital output port. The 10-bit ADC is scaled from -128C to +127C; therefore, the resolution is 0.25C per bit. The ambient temperature operating range of the TC72 is specified from -55C to +125C. This device features a four-wire serial interface that is fully compatible with the SPI specification and, therefore, allows simple communications with common microcontrollers and processors. The TC72 can be used either in a Continuous Temperature Conversion mode or a One-Shot Conversion mode. The TC72 temperature measurements are performed in the background and, therefore, reading the temperature via the serial I/O lines does not affect the measurement in progress. The Continuous Conversion mode measures the temperature approximately every 150 ms and stores the data in the temperature registers. The TC72 has an internal clock generator that controls the automatic temperature conversion sequence. The automatic temperature sampling operation is repeated indefinitely until the TC72 is placed in a shutdown mode by a write operation to the Control register. The TC72 will remain in the shutdown mode until the shutdown bit in the Control register is reset. In contrast, the One-Shot mode performs a single temperature measurement and returns to the power-saving shut down mode. This mode is especially useful for low power applications. MSB LSB 0111 1101 / 0000 0000 Output Code +25C +0.25C MSB LSB 0001 1001 / 0000 0000 MSB LSB 0000 0000 / 0100 0000 MSB LSB 0C 0000 0000 / 0000 0000 Temp -55C MSB LSB 1111 1111 / 1100 0000 MSB LSB 1110 0111 / 0000 0000 Temp +125C -0.125C -25C MSB LSB 1100 1001 / 0000 0000 Note: The ADC converter is scaled from -128C to -127C, but the operating range of the TC72 is specified from -55C to +125C. FIGURE 3-1: Temperature-To-Digital Transfer Function (Non-linear Scale). DS21743A-page 8 2002 Microchip Technology Inc. TC72 3.1 Temperature Data Format 3.3 Serial Bus Interface Temperature data is represented by a 10-bit two's complement word with a resolution of 0.25C per bit. The temperature data is stored in the Temperature registers in a two's complement format. The ADC converter is scaled from -128C to +127C, but the operating range of the TC72 is specified from -55C to +125C. Example: Temperature = 41.5C 00101001b 25 + 23 + 20 32 + 8 + 1 = 41 MSB Temperature Register= = = The serial interface consists of the Chip Enable (CE), Serial Clock (SCK), Serial Data Input (SDI) and Serial Data Output (SDO) signals. The TC72 operates as a slave and is compatible with the SPI bus specifications. The serial interface is designed to be compatible with the Microchip PICmicro(R) family of microcontrollers. The CE input is used to select the TC72 when multiple devices are connected to the serial clock and data lines. The CE is active-high, and data is written to or read from the device, when CE is equal to a logic high voltage. The SCK input is disabled when CE is low. The rising edge of the CE line initiates a read or write operation, while the falling edge of CE completes a read or write operation. The SCK input is provided by the external microcontroller and is used to synchronize the data on the SDI and SDO lines. The SDI input writes data into the TC72's Control register, while the SDO outputs the temperature data from the Temperature register and the status of Shutdown bit of the Control register. The TC72 has the capability to function with either an active-high or low SCK input. The SCK inactive state is detected when the CE signal goes high, while the polarity of the clock input (CP) determines whether the data is clocked and shifted on either the rising or falling edge of the system clock, as shown in Figure 3-2. Table 3-3 gives the appropriate clock edge used to transfer data into and out of the registers. Each data bit is transferred at each clock pulse, and the data bits are clocked in groups of eight bits, as shown in Figure 3-3. The address byte is transferred first, followed by the data. A7, the MSb of the address, determines whether a read or write operation will occur. If A7 = `0', one or more read cycles will occur; otherwise, if A7 = `1', one or more write cycles will occur. Data can be transferred either in a single byte or a multi-byte packet, as shown in Figure 3-3. In the 3-byte packet, the data sequence consists of the MSb temperature data, LSb temperature data, followed by the Control register data. The multi-byte read feature is initiated by writing the highest address of the desired packet to registers. The TC72 will automatically send the register addressed and all of the lower address registers, as long as the Chip Enable pin is held active. LSB Temperature Register = 10000000b = 2-1 = 0.5 TABLE 3-1: Temperature +125C +25C +0.5C +0.25C 0C -0.25C -25C -55C TC72 TEMPERATURE OUTPUT DATA Binary MSB / LSB 0111 1101/0000 0000 0001 1001/0000 0000 0000 0000/1000 0000 0000 0000/0100 0000 0000 0000/0000 0000 1111 1111/1100 0000 1110 0111/0000 0000 1100 1001/0000 0000 Hex 7D00 1900 0080 0040 0000 FFC0 E700 C900 TABLE 3-2: D7 Sign 2-1 D6 26 2-2 D5 25 0 TEMPERATURE REGISTER D4 24 0 D3 23 0 D2 23 0 D1 21 0 D0 20 0 Address/ Register 02H Temp. MSB 01H Temp. LSB 3.2 Power-Up And Power-Down The TC72 is in the low power consumption shutdown mode at power-up. The Continuous Temperature Conversion mode is selected by performing a Write operation to the Control register, as described in Section 4.0, "Internal Register Structure". A supply voltage lower than 1.6V (typical) is considered a power-down state for the TC72. If the supply voltage drops below the 1.6V threshold, the internal registers are reset to the power-up default state. 2002 Microchip Technology Inc. DS21743A-page 9 TC72 TABLE 3-3: Mode Disable Write (A7 = 1) OPERATIONAL MODES CE L H SCK (Note 1) Input Disabled CP=1, Data Shifted on Falling Edge, Data Clocked on Rising Edge CP=0, Data Shifted on Rising Edge, Data Clocked on Falling Edge SDI Input Disabled Data Bit Latch SDO High Z High Z Read (A7 = 0) H CP=1, Data Shifted on Falling Edge, Data Clocked on Rising Edge CP=0, Data Shifted on Rising Edge, Data Clocked on Falling Edge X Next data bit shift, Note 2 Note 1: CP is the Clock Polarity of the microcontroller system clock. If the inactive state of SCK is logic level high, CP is equal to `1'; otherwise, if the inactive state of SCK is low, CP is equal to `0'. 2: During a Read operation, SDO remains at a high impedance (High Z) level until the eight bits of data begin to be shifted out of the Temperature register. 3.4 Read Operation CP = 0 CE The temperature and control register data is outputted from the TC72 using the CE, SCK and SDO lines. Figure 3-3 shows a timing diagram of the read operation. Communication is initiated by the chip enable (CE) going high. The SDO line remains at the voltage level of the LSb bit that is outputted and goes to the tri-state level when the CE line goes to a logic low level. SCK SHIFT EDGE CLOCK EDGE 3.5 Write Operation Data is clocked into the Control register in order to enable the TC72's power saving shutdown mode. The write operation is shown in Figure 3-3 and is accomplished using the CE, SCK and SDI line. CP = 1 CE SCK SHIFT EDGE CLOCK EDGE FIGURE 3-2: Operation. Serial Clock Polarity (CP) DS21743A-page 10 2002 Microchip Technology Inc. TC72 Single Byte Write Operation (CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=1) CE SCK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 A7=1 SDI A 7 A 6 A 5 A 4 A 3 High Z A 2 A 1 A 0 D 7 MSb SDO D 6 D 5 D 4 D 3 D 2 D 1 D 0 LSb Single Byte Read Operation (CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=0) CE SCK 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 A7=0 SDI SDO A 7 A 6 A 5 A 4 A 3 High Z A 2 A 1 A 0 D 7 MSb SPI Multiple Byte Transfer CE SCK Write Operation (CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=1) SDI Address Byte = 80hex A7 A0 D 0 LSb High Z Control Byte D7 D0 SDO High Z Read Operation (CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=0) SDI Address Byte = 02hex A7 A0 SDO High Z MSB Temp. Byte D7 D0 LSB Temp. Byte D7 D0 Control Byte D7 D0 High Z FIGURE 3-3: Serial Interface Timing Diagrams (CP=0). 2002 Microchip Technology Inc. DS21743A-page 11 TC72 4.0 INTERNAL REGISTER STRUCTURE The TC72 registers are listed below. TABLE 4-1: Register Control REGISTERS FOR TC72 Read Address 00hex 01hex 02hex 03hex Write Address 80hex N/A N/A N/A Bit 7 0 T1 T9 0 Bit 6 0 T0 T8 1 Bit 5 0 0 T7 0 Bit 4 One-Shot (OS) 0 T6 1 Bit Bit Bit 321 0 0 0 1 0 1 0 0 0 Bit 0 Shutdown (SHDN) 0 T2 0 Value on POR/BOR 05hex 00hex 00hex 54hex LSB Temperature MSB Temperature Manufacturer ID T5 T4 T3 4.1 Control Register The Control register is both a read and a write register that is used to select either the Shutdown, Continuous or One-Shot Conversion operating mode. The Temperature Conversion mode selection logic is shown in Table 4-2. The Shutdown (SHDN) bit is stored in bit 0 of the Control register. If SHDN is equal to `1', the TC72 will go into the power-saving shutdown mode. If SHDN is equal to `0', the TC72 will perform a temperature conversion approximately every 150 ms. At power-up, the SHDN bit is set to `1'. Thus, the TC72 is in the shutdown operating mode at startup. The Continuous Temperature Conversion mode is selected by writing a `0' to the SHDN bit of the Control register. The Shutdown mode can be used to minimize the power consumption of the TC72 when active temperature monitoring is not required. The shutdown mode disables the temperature conversion circuitry; however, the serial I/O communication port remains active. A temperature conversion will be initialized by a Write operation to the Control register to select either the Continuous Temperature Conversion or the One-Shot operating mode. The temperature data will be available in the MSB and LSB Temperature registers approximately 150 ms after the Control register Write operation. The One-Shot mode is selected by writing a `1' into bit 4 of the Control register. The One-Shot mode performs a single temperature measurement and returns to the power-saving shutdown mode. After completion of the temperature conversion, the One-Shot bit (OS) is reset to `0' (i.e. "OFF"). The user must set the One-Shot bit to `1' to initiate another temperature conversion. Bits 1, 3, 5, 6 and 7 of the Control register are not used by the TC72. Bit 2 is set to a logic `1'. Any write operation to these bit locations will have no affect on the operation of the TC72. 4.2 Temperature Register The Temperature register is a read-only register and contains a 10-bit two's complement representation of the temperature measurement. Bit 0 through Bit 5 of the LSB Temperature register are always set to a logic `0'. At Power-On Reset (POR) or a Brown-Out Reset (BOR) low voltage occurrence, the temperature register is reset to all zeroes, which corresponds to a temperature value of 0C. A V DD power supply less than 1.6V is considered a reset event and will reset the Temperature register to the power-up state. 4.3 Manufacturer ID Register The Manufacturer Identification (ID) register is a readonly register used to identify the temperature sensor as a Microchip component. TABLE 4-2: CONTROL REGISTER TEMPERATURE CONVERSION MODE SELECTION Operational Mode One-Shot (OS) Bit 4 0 0 1 1 Shutdown (SHDN) Bit 0 0 1 0 1 Continuous Temperature Conversion Shutdown Continuous Temperature Conversion (One-Shot Command is ignored if SHDN = `0') One-Shot DS21743A-page 12 2002 Microchip Technology Inc. TC72 5.0 APPLICATIONS INFORMATION The TC72 does not require any additional components in order to measure temperature; however, it is recommended that a decoupling capacitor of 0.1mF to 1mF be provided between the VDD and GND pins. Although the current consumption of the TC72 is modest (250 mA, typical), the TC72 contains an on chip data acquisition with internal digital switching circuitry. Thus, it is considered good design practice to use an external decoupling capacitor with the sensor. A high frequency ceramic capacitor should be used and be located as close as possible to the IC power pins in order to provide effective noise protection to the TC72. The TC72 measures temperature by monitoring the voltage of a diode located on the IC die. The IC pins of the TC72 provide a low impedance thermal path between the die and the PCB, allowing the TC72 to effectively monitor the temperature of the PCB board. The thermal path between the ambient air is not as efficient because the plastic IC housing package functions as a thermal insulator. Thus the ambient air temperature (assuming that a large temperature gradient exists between the air and PCB) has only a small effect on the temperature measured by the TC72. Note that the exposed metal center pad on the bottom of the DFN package is connected to the silicon substrate. The center pad should be connected to either the PCB ground plane or treated as a "No Connect" pin. The mechanical dimensions of the center pad are given in Section 6.0, "Packaging Information", of this datasheet. A potential for self-heating errors can exist if the TC72 SPI communication lines are heavily loaded. Typically, the self-heating error is negligible because of the relatively small current consumption of the TC72. A temperature accuracy error of approximately 0.5C will result from self-heating if the SPI communication pins sink/source the maximum current specified for the TC72. Thus to maximize the temperature accuracy, the output loading of the SPI signals should be minimized. 2002 Microchip Technology Inc. DS21743A-page 13 TC72 6.0 6.1 PACKAGING INFORMATION Taping Form Component Taping Orientation for 8-Pin MSOP Devices User Direction of Feed PIN 1 User Direction of Feed W PIN 1 Standard Reel Component Orientation for TR Suffix Device P Reverse Reel Component Orientation for RT Suffix Device Carrier Tape, Number of Components Per Reel and Reel Size Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 8-Pin MSOP 12 mm 8 mm 2500 13 in Tape and Reel information for the 8-Lead DFN package will be available TBD. DS21743A-page 14 2002 Microchip Technology Inc. TC72 6.2 Package Marking Information 8-Lead MSOP Example: XXXXXX YWWNNN TC722M 221067 8-Lead DFN Example: XXXXXXXX MYWW NNN 7228 8221 067 Legend: XX...X YY WW NNN Customer specific information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information. * Standard OTP marking consists of Microchip part number, year code, week code, and traceability code. 2002 Microchip Technology Inc. DS21743A-page 15 TC72 8-Lead Plastic Micro Small Outline Package (MS) (MSOP) p E E1 D 2 B n 1 A c A1 A2 (F) L Units Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint (Reference) Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom *Controlling Parameter Significant Characteristic Notes: Dimension Limits n p A A2 A1 E E1 D L F c B .030 .002 .184 .114 .114 .016 .035 0 .004 .010 MIN INCHES NOM 8 .026 .044 .034 .193 .118 .118 .022 .037 .006 .012 7 7 .038 .006 .200 .122 .122 .028 .039 6 .008 .016 MAX MIN MILLIMETERS* NOM 0.65 1.18 0.76 0.05 4.67 2.90 2.90 0.40 0.90 0 0.10 0.25 0.15 0.30 7 7 4.90 3.00 3.00 0.55 0.95 0.86 0.97 0.15 .5.08 3.10 3.10 0.70 1.00 6 0.20 0.40 MAX 8 Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. Drawing No. C04-111 DS21743A-page 16 2002 Microchip Technology Inc. TC72 8-Lead Plastic Dual Flat Pack, No Lead (MF) 3x3x1 mm Body (DFN) E p b n L D D2 EXPOSED METAL PAD E2 2 1 PIN 1 ID INDEX AREA (NOTE 2) TOP VIEW BOTTOM VIEW A3 A1 A EXPOSED TIE BAR (NOTE 1) Number of Pins Pitch Overall Height Standoff Lead Thickness Overall Length Exposed Pad Length Overall Width Exposed Pad Width Lead Width Lead Length Units Dimension Limits n p A A1 A3 E E2 D D2 b L MIN INCHES NOM 8 .026 BSC .035 .001 .008 REF. .118 BSC .118 BSC MAX MIN .031 .000 .039 .002 (Note 4) .055 .047 .007 .012 .096 .069 .015 .022 (Note 4) .010 .019 MILLIMETERS* NOM 8 0.65 BSC 0.80 0.90 0.02 0.00 0.20 REF. 3.00 BSC 1.39 3.00 BSC 1.20 0.23 0.26 0.30 0.48 MAX 1.00 0.05 2.45 1.75 0.37 0.55 *Controlling Parameter Notes: 1. Package may have one or more exposed tie bars at ends. 2. Pin 1 visual index feature may vary, but must be located within the hatched area. 3. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. 4. Exposed pad dimensions vary with paddle size. 5. JEDEC equivalent: Pending Drawing No. C04-062 2002 Microchip Technology Inc. DS21743A-page 17 TC72 8-Lead Plastic Dual Flat Pack, No Lead (MF) 3x3x1 mm Body (DFN) X p P1 Y Z G CP G2 THERMAL VIAS ON 4 LAYER PC BOARD 0V H DFN LAND PATTERN H2 OPTIONAL FOUR LAYER PCB LAND PATTERN OPTIONAL TWO LAYER PCB LAND PATTERN Units Terminal Pitch Dimension Limits p Z A1 CP Z X Y H H2 G2 P1 V M .002 (Note 1) M (TYP) INCHES MIN .134 .057 .006 .071 .014 .033 .130 .130 .057 .047 .012 NOM .026 BSC TYPCAL SOLDER MASKS MILLIMETERS* MAX .157 .060 MIN 3.40 1.45 0.15 1.80 .017 .035 0.35 0.85 3.30 3.30 .059 1.45 1.20 0.30 0.05 1.50 0.42 0.88 NOM 0.65 BSC 4.00 1.53 MAX Terminal Land Pattern O.D. Terminal Land Pattern I.D. Exposed Pad Clearance Interior Lead Clearance Terminal Land Width Terminal Land Length Exposed Pad Length Optional Exposed Pad Length Exposed Pad Width Termal Via Pitch Thermal Via Diameter Minimum Solder Mask Clearance *Controlling Parameter Notes: 1. Exposed pad dimensions vary with paddle size. Drawing No. C04-2062 DS21743A-page 18 2002 Microchip Technology Inc. TC72 ON-LINE SUPPORT Microchip provides on-line support on the Microchip World Wide Web site. The web site is used by Microchip as a means to make files and information easily available to customers. To view the site, the user must have access to the Internet and a web browser, such as Netscape(R) or Microsoft(R) Internet Explorer. Files are also available for FTP download from our FTP site. SYSTEMS INFORMATION AND UPGRADE HOT LINE The Systems Information and Upgrade Line provides system users a listing of the latest versions of all of Microchip's development systems software products. Plus, this line provides information on how customers can receive the most current upgrade kits.The Hot Line Numbers are: 1-800-755-2345 for U.S. and most of Canada, and 1-480-792-7302 for the rest of the world. Connecting to the Microchip Internet Web Site The Microchip web site is available at the following URL: www.microchip.com The file transfer site is available by using an FTP service to connect to: ftp://ftp.microchip.com The web site and file transfer site provide a variety of services. Users may download files for the latest Development Tools, Data Sheets, Application Notes, User's Guides, Articles and Sample Programs. A variety of Microchip specific business information is also available, including listings of Microchip sales offices, distributors and factory representatives. Other data available for consideration is: * Latest Microchip Press Releases * Technical Support Section with Frequently Asked Questions * Design Tips * Device Errata * Job Postings * Microchip Consultant Program Member Listing * Links to other useful web sites related to Microchip Products * Conferences for products, Development Systems, technical information and more * Listing of seminars and events 092002 2002 Microchip Technology Inc. DS21734A-page19 TC72 READER RESPONSE It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150. Please list the following information, and use this outline to provide us with your comments about this document. To: RE: Technical Publications Manager Reader Response Total Pages Sent ________ From: Name Company Address City / State / ZIP / Country Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Device: TC72 Questions: 1. What are the best features of this document? Y N Literature Number: DS21734A FAX: (______) _________ - _________ 2. How does this document meet your hardware and software development needs? 3. Do you find the organization of this document easy to follow? If not, why? 4. What additions to the document do you think would enhance the structure and subject? 5. What deletions from the document could be made without affecting the overall usefulness? 6. Is there any incorrect or misleading information (what and where)? 7. How would you improve this document? DS21734A-page20 2002 Microchip Technology Inc. TC72 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device -X.X Voltage Range X Temperature Range XX Package Examples: a) b) c) d) e) f) g) h) TC72-2.8MUA: Digital Temperature Sensor, 2.8V, 8LD MSOP package. TC72-2.8MUATR: Digital Temperature Sensor, 2.8V, 8LD MSOP (tape and reel) package. Device: Voltage Range: TC72: 2.8 3.3 5.0 M Digital Temperature Sensor w/SPI Interface = Accuracy Optimized for 2.8V = Accuracy Optimized for 3.3V = Accuracy Optimized for 5.0V = -55C to +125C TC72-2.8MMF: Digital Temperature Sensor, 2.8V, 8LD DFN package. TC72-3.3MUA: Digital Temperature Sensor, 3.3V, 8LD MSOP package. TC72-3.3MMF: Digital Temperature Sensor, 3.3V, 8LD DFN package. Temperature Range: Package: TC72-5.0MUA: Digital Temperature Sensor, 5.0V, 8LD MSOP package. TC72-5.0MMF: Digital Temperature Sensor, 5.0V, 8LD DFN package. MF = Dual, Flat, No Lead (DFN) (3x3mm), 8-lead MFTR = Dual, Flat, No Lead (DFN) (3x3mm), 8-lead (Tape and Reel) UA = Plastic Micro Small Outline (MSOP), 8-lead UATR = Plastic Micro Small Outline (MSOP), 8-lead (Tape and Reel) TC72-5.0MMFTR: Digital Temperature Sensor, 5.0V, 8LD DFN (tape and reel) package. Sales and Support Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products. 2002 Microchip Technology Inc. DS21743A-page21 TC72 NOTES: DS21743A-page 22 2002 Microchip Technology Inc. Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, KEELOQ, MPLAB, PIC, PICmicro, PICSTART and PRO MATE are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. dsPIC, dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company's quality system processes and procedures are QS-9000 compliant for its PICmicro (R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001 certified. 2002 Microchip Technology Inc. DS21743A - page 23 M WORLDWIDE SALES AND SERVICE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com ASIA/PACIFIC Australia Microchip Technology Australia Pty Ltd Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 Japan Microchip Technology Japan K.K. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Rocky Mountain 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7966 Fax: 480-792-4338 China - Beijing Microchip Technology Consulting (Shanghai) Co., Ltd., Beijing Liaison Office Unit 915 Bei Hai Wan Tai Bldg. No. 6 Chaoyangmen Beidajie Beijing, 100027, No. China Tel: 86-10-85282100 Fax: 86-10-85282104 Korea Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5934 Atlanta 500 Sugar Mill Road, Suite 200B Atlanta, GA 30350 Tel: 770-640-0034 Fax: 770-640-0307 Singapore Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850 Boston 2 Lan Drive, Suite 120 Westford, MA 01886 Tel: 978-692-3848 Fax: 978-692-3821 China - Chengdu Microchip Technology Consulting (Shanghai) Co., Ltd., Chengdu Liaison Office Rm. 2401, 24th Floor, Ming Xing Financial Tower No. 88 TIDU Street Chengdu 610016, China Tel: 86-28-86766200 Fax: 86-28-86766599 Taiwan Microchip Technology (Barbados) Inc., Taiwan Branch 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139 Chicago 333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075 Dallas 4570 Westgrove Drive, Suite 160 Addison, TX 75001 Tel: 972-818-7423 Fax: 972-818-2924 China - Fuzhou Microchip Technology Consulting (Shanghai) Co., Ltd., Fuzhou Liaison Office Unit 28F, World Trade Plaza No. 71 Wusi Road Fuzhou 350001, China Tel: 86-591-7503506 Fax: 86-591-7503521 Detroit Tri-Atria Office Building 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Tel: 248-538-2250 Fax: 248-538-2260 EUROPE Austria Microchip Technology Austria GmbH Durisolstrasse 2 A-4600 Wels Austria Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 China - Shanghai Microchip Technology Consulting (Shanghai) Co., Ltd. Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060 Kokomo 2767 S. Albright Road Kokomo, Indiana 46902 Tel: 765-864-8360 Fax: 765-864-8387 Denmark Microchip Technology Nordic ApS Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45 4420 9895 Fax: 45 4420 9910 Los Angeles 18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338 China - Shenzhen Microchip Technology Consulting (Shanghai) Co., Ltd., Shenzhen Liaison Office Rm. 1315, 13/F, Shenzhen Kerry Centre, Renminnan Lu Shenzhen 518001, China Tel: 86-755-2350361 Fax: 86-755-2366086 New York 150 Motor Parkway, Suite 202 Hauppauge, NY 11788 Tel: 631-273-5305 Fax: 631-273-5335 France Microchip Technology SARL Parc d'Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 San Jose Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955 China - Hong Kong SAR Microchip Technology Hongkong Ltd. Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Germany Microchip Technology GmbH Steinheilstrasse 10 D-85737 Ismaning, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44 Toronto 6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509 India Microchip Technology Inc. India Liaison Office Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O'Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062 Italy Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883 United Kingdom Microchip Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820 08/01/02 DS21743A-page 24 2002 Microchip Technology Inc. |
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